mspacmanarcademachine| Qualcomm Snapdragon XPlus platform: the world's fastest notebook NPU, the computing power chip industry chain continues to benefit
Newsletter summary
Qualcomm launches Snapdragon XPlus platformMspacmanarcademachineTo promote the development of the computing chip industry; SK Hynix HBM3E development progress, sun and moon advanced packaging capacity in short supply; Seagate technology hard disk prices, the industry chain benefits. Shenwan Electronics Index rose this week, optimistic about AI computing chips, HBM, advanced packaging, memory chip industry chain. Risk tips include Sino-US trade frictions, downstream demand and domestic substitution expectations.
Text of news flash
[Qualcomm Snapdragon XPlus platform accelerates the development of the computing chip industry] Qualcomm recently launched a new computing chip platform-Snapdragon XPlus, which uses Qualcomm OryonCPU and Qualcomm HexagonNPU. This move is designed to meet the needs of terminal-side AI applications, is expected to accelerate the development of the computing chip industry, the related industry chain is expected to continue to benefit. The research and development of SK Hynix 12-layer stacked HBM3E memory is progressing smoothly and is expected to be completed in the third quarter of this year. As customers focus on 8Hi HBM3E memory in 2024, there will be an overall increase in demand for 12Hi HBM3E memory in 2025. The continuous promotion of HBM and other cutting-edge memory chips by storage manufacturers is expected to lead to the continuous benefit of the relevant industry chain. The development of AI technology also promotes the growth of the demand for advanced packaging. Nikko said that the current supply of advanced packaging capacity exceeds demand, and this trend is expected to continue until 2025. The importance of advanced packaging in the computing era has become increasingly prominent, and the related industry chain will continue to benefit. Seagate Technology has announced that it will immediately raise the price of hard drives to cope with the impact of supply constraints. Hard drive prices are expected to continue to rise in the coming quarters. With the continuous improvement of downstream demand, the price of memory chips is expected to rise further, bringing continuous benefits to the related industry chain. In terms of market conditions, the A-share Shenwan Electronic Index is up 5% this week.Mspacmanarcademachine.21%, strong performance. Among the six sub-plates of Shenwan Electronics II, the component plate led the rise by 6.8%. Overseas markets were also strong, with Hang Seng Technology at the top of the list with an increase of 13.43%. Investment advice, continue to be optimistic about the AI as the core of the computing chip industry chain, and benefit from the rapid development of advanced computing chip HBM industry chain. At the same time, storage and advanced packaging, as the main line of semiconductor cycle recovery, are also areas of concern. Suggested companies include Cambrian, Haiguang Information, Jingjiawei (300474), Godson Zhongke and other computing chip manufacturers; HBM industry chain related companies such as Sateng shares (603283), Yishitong, Lianrui New Materials, Huahai Chengke; advanced packaging enterprises such as Yongsi Electronics, Zhongfu Circuit, Jingfang Technology (603005), Blue Arrow Electronics, etc. And Dongxin shares, Hengshuo shares, Baiwei Storage, Jiang Bolong, Demingli, Shenzhen Technology (000021) and other memory chip manufacturers. The risks that investors need to pay attention to include increased trade frictions between China and the United States, lower-than-expected terminal demand and less-than-expected domestic substitution process. By taking into account market dynamics and corporate performance, investors can make more informed investment decisions.
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